Capability
PRODUCTION CAPABILITY | |
Certifications | |
ISO 9001:2008 | Yes |
TS 16949 | Yes |
ISO 14001 | Yes |
RoHS Compliant | Yes |
Other | Yes |
Surface Finishes | |
HASL | 3-25 um |
HASL-Lead free | 3-25 um |
Immersion Tin | 0,80-1,20 um |
Immersion Silver | 0,12-0,38 um |
ENIG (immersion gold) | Ni:2-3,75 um,0,05-1,20 um |
OSP | Yes |
Electrolytic Hard Gold (Au thickness) | 0,025-1,27 um |
Electrolytic Soft Gold (Au thickness) | 0,025-1,20 um |
Electrolytic Gold For Wire Bond | 0,38-0,75 um |
Selective Finishes (More than one finish) | ENIG + OSP / HASL+Gold finger / ENEPIG |
Copper thickness | |
0.5-6 oz | Yes |
Other | Specail 10 oz |
Layers & Board thickness | |
Single sided | 0,1-8,0 mm |
Double sided | 0,2-8,0 mm |
Multilayer | 0,4-6,0 mm |
4 – 6 layer | 0,4-6,0 mm |
8 –12 layer | 1-6 mm |
Over 12 layer | 1,4-6,0 mm |
Max.layer count-Flex | 8 |
Max.layer count-Rigid / Flex | 8 |
Material Types | |
FR-4 / FR4 (170) / FR4 (180 | Yes |
Flex | Yes |
Rigid / Flex | Yes |
Ceramic | Rogers |
Polyimide | yes |
Hybrid | Rogers+FR-4;PTFE+FR-4 |
Aluminum | Bergquist & Tolking & BoYu , others |
Minimum Line Width and Spacing | |
3mil | Yes |
Minimum Drilled Hole Size | |
Laser drilling | 4 mil |
CNC Drill | 8 mil |
Minimum Tolerances | |
PTH | +/-0,05 mm |
NPTH | +/-0,05 mm |
Outline-routed | +/-0,10 mm |
Outline-scored | +/-0,15 mm |
Scoring | |
20°, 30°, 45°, 60° | Yes |
Jump Scoring | Yes |
Soldermask | |
Colors available | Green, Black, White, Blue, Yellow, Red |
Legend Print/Silkscreen | |
Colors available | White, Yellow , Black , Red , Blue , Pink |
Additional Process Capabilities | |
Peelable Mask | Yes |
Max.diameter to tent with peelable mask | 3,0 mm |
Max.peelable mask thickness | 0,40 mm |
Via hole filler soldermask (100% fill) | Yes |
Via hole filler soldermask max.hole diameter | 0,60 mm |
Conductive Hole Filler (Silver/Copper) | Yes |
Carbon Ink minimum spacing | 0,15 mm |
Half-hole plating | Yes |
Edge Plating | Yes |
Min.hole wall plating thickness | 25 um |
Countersinks | 90° |
Bevelling | 20°, 30°, 45°, 60° |
Controlled depth routing | Yes |
Hard Gold Finger (Gold thickness) | 0,025 – 1,27 um |
Blind Via Construction | Yes |
Buried Via Construction | Yes |
Via in pad | Yes |
Controlled Impedance | Yes |