PRODUCTION CAPABILITY
Certifications
ISO 9001:2008	Yes
TS 16949	Yes
ISO 14001	Yes
RoHS Compliant	Yes
Other	Yes
Surface Finishes
HASL	3-25 um
HASL-Lead free	3-25 um
Immersion Tin	0,80-1,20 um
Immersion Silver	0,12-0,38 um
ENIG (immersion gold)	Ni:2-3,75 um,0,05-1,20 um
OSP	Yes
Electrolytic Hard Gold (Au thickness)	0,025-1,27 um
Electrolytic Soft Gold (Au thickness)	0,025-1,20 um
Electrolytic Gold For Wire Bond	0,38-0,75 um
Selective Finishes (More than one finish)	ENIG + OSP /  HASL+Gold finger / ENEPIG
Copper thickness
0.5-6 oz	Yes
Other	Specail 10 oz
Layers & Board thickness
Single sided	0,1-8,0 mm
Double sided	0,2-8,0 mm
Multilayer	0,4-6,0 mm
4 – 6 layer	0,4-6,0 mm
8 –12 layer	1-6 mm
Over 12 layer	1,4-6,0 mm
Max.layer count-Flex	8
Max.layer count-Rigid / Flex	8
Material Types
FR-4 / FR4 (170) / FR4 (180	Yes
Flex	Yes
Rigid / Flex	Yes
Ceramic	Rogers
Polyimide	yes
Hybrid	Rogers+FR-4;PTFE+FR-4
Aluminum	Bergquist & Tolking & BoYu , others
Minimum Line Width and Spacing
3mil	Yes
Minimum Drilled Hole Size
Laser drilling	4 mil
CNC Drill	8 mil
Minimum Tolerances
PTH	+/-0,05 mm
NPTH	+/-0,05 mm
Outline-routed	+/-0,10 mm
Outline-scored	+/-0,15 mm
Scoring
20°, 30°, 45°, 60°	Yes
Jump Scoring	Yes
Soldermask
Colors available	Green, Black, White, Blue, Yellow, Red
Legend Print/Silkscreen
Colors available	White, Yellow , Black , Red , Blue , Pink
Additional Process Capabilities
Peelable Mask	Yes
Max.diameter to tent with peelable mask	3,0 mm
Max.peelable mask thickness	0,40 mm
Via hole filler soldermask (100% fill)	Yes
Via hole filler soldermask max.hole diameter	0,60 mm
Conductive Hole Filler (Silver/Copper)	Yes
Carbon Ink minimum spacing	0,15 mm
Half-hole plating	Yes
Edge Plating	Yes
Min.hole wall plating thickness	25 um
Countersinks	90°
Bevelling	20°, 30°, 45°, 60°
Controlled depth routing	Yes
Hard Gold Finger (Gold thickness)	0,025 – 1,27 um
Blind Via Construction	Yes
Buried Via Construction	Yes
Via in pad	Yes
Controlled Impedance	Yes